Spire QuadroFlow V Intel Socket 775 Kylning copper core

Spire QuadroFlow V Intel Socket 775 Kylning copper core


Introducing the QuadroFlow V. Designed to cool the socket 775 Intel LGA Prescott micro processors. Utilizing our unique 12 point star aluminum high-density heat sink with massive copper core we have successfully created quality cost effective LGA 775 cpu cooler.

Main Features:
* Supports all new P4 Prescott LGA-775 micro-processors
* 90x90x25mm Sleeve bearing fan for silent operation
* Extruded heat-sink with massive copper-core for optimal heat conductivity

Product Includes :
*Multilanguage Owner Manual *S-420 White thermal grease * Back-plate


Product Specification:
Socket 775 Cooling kit
Dimensionsv Heat sink : 92×92×32 mm (l × w × h)
12VDC Fan : 90×90×25 mm
Bearing Sleeve bearing
Rated speed 2000 RPM +/-10%
Rated power 2.16 W
Noise level 21.0 dBA
Air flow 38.95 CFM at 2000 RPM +/10%
Current 0.18 A
Life hours Sleeve: 30.000
Features Large copper core, Thumb-screw solid and secure mounting
Connector 3 pin mainboard connector
Application
Intel : Celeron D ~ 2.93 GHz (340J)
Intel : Core 2 Duo ~ 3.0 GHz (775 Dual-core)
Intel : Core 2 Extreme ~ 3.2 GHz (775 Dual-core)
Core 2 Quad ~ 2.66 GHz (775 Quad-core)
LGA775 ~ 3.73 GHz (Prescott)
Thermal resistance @ 2000 RPM 0.31 °C/W
Thermal type White grease pre-applied